Average Reviews:
(More customer reviews)At first, I was looking for a book covering on-chip power integrity issue and happened to find this book on Amazon. Since I can not search inside this book, I just bought it and later found it is related to the power integrity of package, not chip. However, I DEFINITELY don't regret buying this book because it covers one of the important pieces in the design of power distribution network.
After reading chapter 1, I realize that the power integrity issue should be attacked from a system point of view, including chip, package and board. Only considering on-chip power integrity is not enough because the power supply is located on the board and electrically far away from the chip. The important concept of target impedance is also introduced and really opens my mind on how to design a robust power distribution network.
Chapter 2 covers the modeling of power/ground planes in high performance package and board. Two novel modeling methods, transmission matrix method and cavity-model method are desrcibed in detail here. The major advantages of the two methods over full wave methods, like FDTD and FEM, are ease of integrating into circuit simulators.
Chapter 3 covers the topic of simultaneous switching noises. The signal nets are modeled as uncoupled microstrip and strip transmission lines. The coupling effects between signals and power/ground planes are modeled as controlled sources, which are obtained by mode decomposistion methods. Then, the uncoupled transmission lines and controlled sources are integrated with the power/ground plane models from chapter 2 to conduct simultaneous switching noise analysis.
Chapter 4 introduces time-domain simulations of power distribution networks. The major foucs is how to incorporate s-parameter data into time-domain circuit simulators. The techniques like vetor fitting, passivitiy enforcement by Hamiltonian matrix , signal flow method, and MNA with s-parameter are explained and compared.
Chapter 5 applies the modeling and analysis methods from previous chapters to real applications. Great insight is learned from these real world problems.
I strongly recommend this book to the designers and CAD tool developers of power distribution networks. Since the major focus of this book is package power, I also recommend two other books which cover board and on-chip power integirty issue respectively:
"Frequency-Domain Characterization of Power Distribution Networks" by Istvan Novak and Jason R. Miller
"Power Distribution Networks with On-Chip Decoupling Capacitors" by Mikhail Popovich, Andrey V. Mezhiba, and Eby G. Friedman
Click Here to see more reviews about: Power Integrity Modeling and Design for Semiconductors and Systems
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling
Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.
Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.
The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.
The authors
Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements
Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more
Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis
Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages
Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures
This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
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