Noise Coupling in Integrated Circuits: A Practical Approach to Analysis, Modeling, and Suppression Review

Average Reviews:

(More customer reviews)This is a clear, concise, and easy to understand book that does a wonderful job of explaining the fundamentals of noise coupling in integrated circuits including the parasitcs on package and PCB power distribution. A lot of effort has been put on simplifying things and explaining common misconceptions. With a correct mental image of noise coupling mechanisms it is then very easy to understand why some suppression techniques are more efficient in some applications and less efficient in others, and why some very accurate extraction and simulation tools may sometimes generate totally inaccurate results, things that frustrate many designers these days. Each section provides a bullet point summary of one or two sentences reinforcing the key concepts of the section and providing a convenient and easy referral after reading the text.

Click Here to see more reviews about: Noise Coupling in Integrated Circuits: A Practical Approach to Analysis, Modeling, and Suppression

Click here for more information about Noise Coupling in Integrated Circuits: A Practical Approach to Analysis, Modeling, and Suppression

Read More...

Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages Review

Average Reviews:

(More customer reviews)This book is not Howard Johnson's "Black Magic..". It is not one of the many books discussing practical rules of thumb to solve EMI and signal integrity issues. It covers the basics but the emphasis is to understand the modeling and simulation of signal integrity issues. It is theoretical but not in a very complicated mathematical way. You don't need to know Maxwell's equations, but you need to be able to follow some simple matrix equations. The book can be a little hard to read at some points but some of the sections are a joy. For example, the simple models showing the skin effect and current crowding are the best I have seen in any book on this subject. Without using any advanced math, but simply breaking down the wires into a few sections and using nothing more than inductance, mutual inductance, and resistance, the author shows how skin effect and current crowding come about. The section on capacitance matrices, definition of partial inductance and the different definitions of inductance: Field-based, Energy-based, and thin wire, clear up many questions I had about these concepts. When I first started using this book for a class I took, I had bought Daly's book as I thought it was easier to read and covered more practical subjects. I have completely changed my first impression. Daly's book although containing many practical subjects is badly written, while this book which doesn't have the friendliest fonts and presentation is actually a very good book. I have to thank the instructor for choosing this book. I would have never bought it on my own.

Click Here to see more reviews about: Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages

For advanced courses in digital design.This state-of-the-art book provides students with techniques for predicting and achieving target performance levels. Gives students all the theory, practice, general signal integrity issues, and leading-edge experimental techniques they need to accurately model and simulate those interconnections and predict real-world performance.

Get 10% OFF

Click here for more information about Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages

Read More...

Power Integrity Modeling and Design for Semiconductors and Systems Review

Average Reviews:

(More customer reviews)At first, I was looking for a book covering on-chip power integrity issue and happened to find this book on Amazon. Since I can not search inside this book, I just bought it and later found it is related to the power integrity of package, not chip. However, I DEFINITELY don't regret buying this book because it covers one of the important pieces in the design of power distribution network.
After reading chapter 1, I realize that the power integrity issue should be attacked from a system point of view, including chip, package and board. Only considering on-chip power integrity is not enough because the power supply is located on the board and electrically far away from the chip. The important concept of target impedance is also introduced and really opens my mind on how to design a robust power distribution network.
Chapter 2 covers the modeling of power/ground planes in high performance package and board. Two novel modeling methods, transmission matrix method and cavity-model method are desrcibed in detail here. The major advantages of the two methods over full wave methods, like FDTD and FEM, are ease of integrating into circuit simulators.
Chapter 3 covers the topic of simultaneous switching noises. The signal nets are modeled as uncoupled microstrip and strip transmission lines. The coupling effects between signals and power/ground planes are modeled as controlled sources, which are obtained by mode decomposistion methods. Then, the uncoupled transmission lines and controlled sources are integrated with the power/ground plane models from chapter 2 to conduct simultaneous switching noise analysis.
Chapter 4 introduces time-domain simulations of power distribution networks. The major foucs is how to incorporate s-parameter data into time-domain circuit simulators. The techniques like vetor fitting, passivitiy enforcement by Hamiltonian matrix , signal flow method, and MNA with s-parameter are explained and compared.
Chapter 5 applies the modeling and analysis methods from previous chapters to real applications. Great insight is learned from these real world problems.
I strongly recommend this book to the designers and CAD tool developers of power distribution networks. Since the major focus of this book is package power, I also recommend two other books which cover board and on-chip power integirty issue respectively:
"Frequency-Domain Characterization of Power Distribution Networks" by Istvan Novak and Jason R. Miller
"Power Distribution Networks with On-Chip Decoupling Capacitors" by Mikhail Popovich, Andrey V. Mezhiba, and Eby G. Friedman


Click Here to see more reviews about: Power Integrity Modeling and Design for Semiconductors and Systems


The First Comprehensive, Example-Rich Guide to Power Integrity Modeling
Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.

Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.

The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.

The authors

Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements
Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more
Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis
Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages
Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures

This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Get 25% OFF

Click here for more information about Power Integrity Modeling and Design for Semiconductors and Systems

Read More...